IPC 4555 – Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Product Details
- Published:
- 04/01/2022
- ISBN(s):
- 9781638160748
- Number of Pages:
- 24
- File Size:
- 1 file , 990 KB
- Product Code(s):
- 4555-STD-0-D-0-EN-0, 4555-STD-0-D-0-EN-0
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
