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IPC J-STD-013

IPC J-STD-013

Original price was: $131.00.Current price is: $79.00.

Implementation of Ball Grid Array and Other High Density Technology

Published by	Publication Date	Number of Pages
IPC	08/01/1996	123

Category: IPC

Description

IPC J-STD-013 – Implementation of Ball Grid Array and Other High Density Technology

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.

Product Details

Published:: 08/01/1996
Number of Pages:: 123
File Size:: 1 file , 1.3 MB
Product Code(s):: J-013(D)1
Note:: This product is unavailable in Russia, Ukraine, Belarus

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IPC J-STD-013

~~$131.00~~ $79.00